A ball grid array circuit is manufactured by an engineer so that they can make an accurate connection between the Printed Circuit Board (PCB) and the chip itself. In some cases, an older ball joint will necessitate the recreation of the ball solder joints by the engineer, so that work can be extracted from that particular BGA chip.
BGA repair and rework can be for a variety of reasons: from overuse to faulty BGA components, as well as ineffective soldier joints and even changes to the engineering parts.
Re-balling is a particularly cost-effective solution as it typically prevents the need to replace the entire system. BGA re-balling allows for:
- Reuse of already mounted BGAs for migration from an old revision PCB to a new revision.
- Removal and replacement of a BGAs for testing
- Repair of defects joints with either insufficient or excessive solder.
- Repair of damaged or missing BGA pads or balls
- X-Ray Inspection
Not all re-balling services and procedures are the same. At Circuits Central complimenting the use of industry proven methods and tools for BGA rework, we have developed a unique technique through our R&D department for a cost effective and reliable re-balling service.
We provide our clients with high-quality, comprehensive re-balling services at highly affordable rates. We accomplish the job right the first time. Our service is highly efficient and hassle-free. We will take the time to discuss your concerns in order to meet your specifications. The level of customer service that we offer at Circuits Central ensures that you’ll be satisfied with the results of your BGA repair.
If you are in need of high-quality BGA re-balling or rework, you’ve come to the right place!
